Reballing laptop

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Re-balling Set includes

• XURB-BF – Base with stencil holding frame. One universal frame holds the XURB-I insert 
• specific for the IC body up to a size 40x40mm, and has one frame holding the stencil which is 
• specific for balls pattern and size
• XURB-I-xyz – Insert specific for an IC body size (width, lengths, thickness).
• XURB-S-A-B-xy – Re-balling stencil matching the insert above where A is the
•  number of balls, B - ball's pitch, and xy - IC body size.
• Micro Squeegee
• Tweezers
• 10cc Paste Flux Syringe

XURB-I – Insert specific for an IC body size.

P/N	Stencil P/N match to Insert
XURB-I-15-1.2	XURB-S-156-1-15
XURB-I-23-1.6	XURB-S-456-1-23
XURB-I-27-1.6	XURB-S-324-1.27-27 XURB-S-352-1.27-27
XURB-I-31-1.8	XURB-S-696-1-31
XURB-I-35-1.8	XURB-S-388-1.27-35 XURB-S-456-1.27-35 XURB-S-492-1.27-35 XURB-S-596-1.27-35
XURB-I-37.5-1.8	XURB-S-676-1.27-37.5
XURB-I-40-1.6	XURB-S-432-1.27-40

Solder Balls

Part Number	Description	Qty in container
	Alloy Sn62/Pb36/Ag2
XSB-0.3-10	Ball Diameter 0.3mm, (0,012")  Small Containers	10 000 pcs
XSB-0.3-25	Ball Diameter 0.3mm, (0,012")  Small Containers	25 000 pcs
XSB-0.3-50	Ball Diameter 0.3mm, (0,012")  Small Containers	50 000 pcs
XSB-0.45-10	Ball Diameter 0.45mm,(0,018")  Small Containers	10 000 pcs
XSB-0.45-25	Ball Diameter 0.45mm,(0,018")  Small Containers	25 000 pcs
XSB-0.45-50	Ball Diameter 0.45mm,(0,018")  Small Containers	50 000 pcs
XSB-0.5-10	Ball Diameter 0.5mm,  (0.020")  Small Containers	10 000 pcs
XSB-0.5-25	Ball Diameter 0.5mm,  (0.020")  Small Containers	25 000 pcs
XSB-0.5-50	Ball Diameter 0.5mm,  (0.020")  Small Containers	50 000 pcs
XSB-0.63-10	Ball Diameter 0.63mm, (0,0252")  Small Containers	10 000 pcs
XSB-0.63-25	Ball Diameter 0.63mm, (0,0252")  Small Containers	25 000 pcs
XSB-0.63-50	Ball Diameter 0.63mm, (0,0252")  Small Containers	50 000 pcs
XSB-0.76-10	Ball Diameter 0.76mm, (0,0304")  Small Containers	10 000 pcs
XSB-0.76-25	BallDiameter 0.76mm, (0,0304")  Small Containers	25 000 pcs
XSB-0.76-50	Ball Diameter 0.76mm, (0,0304")  Small Containers	50 000 pcs
	Lead Free Alloy Sn 96,5% - Ag-3% - Cu-0,5%
XSB-0.3LF-10	Ball Diameter 0.3mm, (0,012")  Small Containers	10 000 pcs
XSB-0.3LF-25	Ball Diameter 0.3mm, (0,012")  Small Containers	25 000 pcs
XSB-0.3LF-50	Ball Diameter 0.3mm, (0,012")  Small Containers	50 000 pcs
XSB-0.45LF-10	Ball Diameter 0.45mm,(0,018")  Small Containers	10 000 pcs
XSB-0.45LF-25	Ball Diameter 0.45mm,(0,018")  Small Containers	25 000 pcs
XSB-0.45LF-50	Ball Diameter 0.45mm,(0,018")  Small Containers	50 000 pcs
XSB-0.5LF-10	Ball Diameter 0.5mm,  (0.020")  Small Containers	10 000 pcs
XSB-0.5LF-25	Ball Diameter 0.5mm,  (0.020")  Small Containers	25 000 pcs
XSB-0.5LF-50	Ball Diameter 0.5mm,  (0.020")  Small Containers	50 000 pcs

How to use the Re-balling Set

Before Beginning to reball you component you must first remove the old solder balls and solder residual. It is recommended that you use XS-StencilCleaner each time you perform the reballing process. this will extend the life of your stencil and improve the reballing process. Place the XURB Insert into the Reballing frame.
Place the component to be reworked in the insert with the surface to be reballed face up.
Use the Micro Squeegee to apply flux evenly to the IC body.
Place the appropriate re-balling stencil over the IC ensuring that it aligns with the positioning pins on the insert.
Place the stencil holding frame on the top of the stencil and tighten the knob.
Distribute the balls across the stencil using tweezers or a brush if needed until each opening contains one ball. Excess balls should be poured carefully back into the container through a large opening in the top corner. To Reflow:There are several choices how the balls can be reflow: Use X-KAR XURB, Independent Re-balling Heating Unit, which offers the fastest, and the most efficient reflow Place the Base Unit with component, stencil, and the frame in the oven and start reflow cycle. Use any of X-KAR Pre-heater units to reflow the balls. Remove reballing set from the oven or cool down the X-KAR Preheater to allow the package to cool. Remove the frame, reballing stencil, and the component. Inspect the quality of rebal So... Once upon a time I came to a conclusion that there's a need to reball a PS3 console. Customer brought a 60GB YLOD console which was attempted to be fixed before. After the first reflow console came alive and worked for around couple minutes, then died again with Red Blinking Light. While reflowing for the second time I used some high quality flux. After reflow the same scenario, came alive, turned it off and it came back with Red Blinking Light. The reball was the only solution, so I cranked up my JOVY switched on the Aoyue and with not much enthusiasm the reball process was started. Here are some pics how I got on. Once the heatsink came off at 140C the RSX was lifted without much effort. The residue left from earlier reflows. Close up of overburned flux. The RSX ready to be cleaned. While cleaning the chip the coating has come off in couple places. I called this chip faulty and binned it. However the motherboard cleaned up pretty nicely, some effort was required though. 60GB motherboard is massive. Close up of perfectly clean RSX chip motherboard spot. The new chip came to the rescue. Also removed from 60Gb motherboard. Reballed using Aoyue 968 and 0.6mm leaded solder balls. The reballing jig of eBay is very poor quality. Admiring the masterpiece. All the solder balls aligned perfectly. RSX heatsink cleaned up from old thermal paste and ready to go back on. The board went under JOVY and everyting seem to be fine. Heatsink went back on using new thermal paste and Arctic Silver Ceramique on RSX Ram.